HG2283 SK Hynix V7 – MPTool 1.3.4

Package

ArchiveHG2283 SK Hynix V7 – MPTool 1.3.4.7z
BrandPhison
TypeMass production tool package
ControllerHG2283
NAND targetSK Hynix V7
Contents15 files, 21.6 MB unpacked

Component versions

ComponentVersionSource
Date (archive name)20230607archive name
MPTool1.3.4archive name

Controller

HG2283 NVMe SSD controller. The tool is a Phison-style PCIe MPTool (PCIeMPTool.exe, PCIe_MPAPI.dll).

Function

Mass production (MP) tool package. The tool initializes the drive, loads the controller firmware, scans and records bad blocks, and writes the drive identity (model, serial number, capacity). Packages with RDT firmware can run a burn-in test before the final firmware is written. Running the tool re-initializes the drive; existing user data is lost.

Notes

  • A file name gives the tool settings password: “password123”.

Firmware images (5)

APF1M1R1.bin, APF1M3R0.bin, APS1M1R1.bin, APS1M3R1.bin, SB_ISP_RAM.BIN

Package contents

PathDescriptionSize
Bin\Firmware images5 files, 5.4 MB
Config\Configuration files4 files, 4.0 KB
Common.iniSettings334 B
JMS583 flash this firmware if HG2283 init fails.binBinary image65.5 KB
PCIe_FlashInfo.datFlash database (encoded)7.8 KB
PCIe_MPAPI.dllLibrary13.8 MB
PCIeMPTool.exeExecutable2.3 MB
password 123name: password1230 B

Executables

  • PCIeMPTool.exe

Flash database (23 entries)

Source: PCIe_FlashInfo.dat, Config/01_EraseAll.ini, Config/02_RDT.ini, Config/03_RDTResult.ini, Config/04_MP.ini. Entries from all copies in the package are merged; duplicates are listed once.

Intel (2)

Part numberFamilyFlash IDTypeFirmware
Intel-B16B1689 A4 08 32 A1 00TLC_16KEDSM20.0.BIN, EDFC20B0.BIN
UN256G4B1B1ASC-B16-IntelB1689 C4 89 32 A1 00TLC_16KEDSM20.0.BIN, EDFC20B0.BIN

Toshiba (6)

Part numberFamilyFlash IDTypeFirmware
TC58TFG8T23TA0D-Gen3BICS398 3C 98 B3 76 72TLC_16KEDSM00.0.BIN, EDFC00.5.BIN
Toshiba-Gen4-ToggleBICS498 3C 98 B3 76 E3TLC_16KEDSM00.0.BIN, EDFC00.5.BIN
Toshiba-Gen4-ToggleBICS498 3E 98 B3 76 E3TLC_16KEDSM00.0.BIN, EDFC00.5.BIN
TH58TFT0T24BA4KBICS498 3E 98 B3 76 E3TLC_16KEDSM00.0.BIN, EDFC00.5.BIN
TH58LJT2T24BA8HBICS498 48 99 B3 7A E3TLC_16KEDSM00.0.BIN, EDFC00.5.BIN
Toshiba-BICS4BICS498 73 9C B3 76 E3QLCEDSM00.0.BIN, EDFC00.5.BIN

SanDisk (3)

Part numberFamilyFlash IDTypeFirmware
SandiskGen4 sBICS445 3C 98 B3 76 6BTLC_16KEDSM00.0.BIN, EDFC00.5.BIN
SanDisk-Gen4BICS445 3E 98 B3 76 63TLC_16KEDSM00.0.BIN, EDFC00.5.BIN
SDRNCIDMM-512GCEBICS445 48 99 B3 7A 6BTLC_16KEDSM00.0.BIN, EDFC00.5.BIN

Micron (2)

Part numberFamilyFlash IDTypeFirmware
MT29F1T08EELCEB27B2C C3 08 32 E6 00TLC_16KEDSM60.0.BIN, EDFC60.0.BIN
Micron-N28N282C D3 1C 32 C6 00TLC_16KEDSM70.0.BIN, EDFC70.0.BIN

YMTC (3)

Part numberFamilyFlash IDTypeFirmware
YMTC-JGSJGS9B C3 48 25 10 00TLC_16KEDSMB0.0.BIN, EDFCB0.5.BIN
YMTC-JGSJGS9B C4 49 25 10 00TLC_16KEDSMB0.0.BIN, EDFCB0.5.BIN
YMTC-TASTAS9B C4 28 49 20 00TLC_16KEDSME0.0.BIN, EDFME0T1.bin

Samsung (3)

Part numberFamilyFlash IDTypeFirmware
Samsung-V6SSV6EC 5E 98 AF 84 CDTLC_16KAPS1M1R1.bin, APF1M1R1.bin
EraseAllPCIe-2283HGEC 5E 98 AF 84 CDTLC_16K model “PCIe SSD”
RDTResultPCIe-2283HGEC 5E 98 AF 84 CDTLC_16K model “PCIe SSD”

SK Hynix (4)

Part numberFamilyFlash IDTypeFirmware
Hynix-V73DV7AD 7E 28 0B 00 C0TLC_16KAPS1M3R1.bin, APF1M3R0.bin
Hynix-V73DV7AD 7E 29 0B 00 C0TLC_16KAPS1M3R1.bin, APF1M3R0.BIN
RDTPCIe-2283HGAD 7E 28 0B 00 C0TLC_16K model “PCIe SSD”
MPPCIe-2283HGAD 7E 28 0B 00 C0TLC_16K model “NVME SSD 512GB”

Information on this page was read from the package files and the archive name.